There are restrictions within certain cleanrooms but the following substrates types have been used in the P&PD laboratories:
Resizing of some substrates is also offered through our Laser Dicing service
The P&PD laboratories offer a range of lithography exposure tools including ebeam and nanoimprint lithography capability and associated resist processes , the exposure tools which are currently available are:
There is a suite of resist processes to suit different applications ranging from wet/plasma etch to patterning by lift off. A range of resist application systems area available to suit different applications and substrate types:
We offer a wide range of material deposition systems and associated materials:
Low Pressure Chemical Vapour Deposition (LPCVD) of polysilicon and silicon nitride in Thermco 9000 furnaces
Plasma Enhanced Chemical Vapour Deposition (PECVD) of silicon oxides, silicon oxides doped with phosphorous, boron and Germanium and of silicon nitrides and oxynitrides in Electrotech Delta 201, STS 310 and STS Multiplex systems
Atomic Layer Deposition (ALD) of various metals, oxides and barrier layers in a Cambridge Nanotech Fiji 200 system
Physical Vapour Deposition (PVD) of metals and dielectrics in batch systems like the Nordiko 2550 Sputterer and the Oxford Instruments Plasmalab 400 and in the LESKAR CMS-18single wafer confocal system
We offer different plasma etch systems across the cleanrooms to meet our customer requirements, etching of dielectrics, metals and polymers are available. The etch systems we have are as follows:
Trikon Omega 201 MORI
Trikon Omega 201 PERIE
Trikon Omega 201 ICP
During the course of any device fabrication there is a need to thermal treatment be it for silicon oxidation, implant activation, silicide formation, metal contact annealing or polymer curing. We have systems suitable for all of these processes:
Thermco 9000 Furnaces – wet/dry oxidation, nitrogen annealing, forming gas alloy, silicon doping
Primarily used in silicon device fabrication we have a medium current system for implant of phosphorus, arsenic and boron species: