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Leader in Integrated ICT Hardware & Systems

Facility Description

Facility Description

Tyndall provides a wide range of services to industry and academia helping. The services available include wafer fabrication, test and measurement, intellectual property investigation, microscopy analysis, temperature and environmental characterisation, integration and packaging and many more. These professional services are provided on a commercial contract basis and are delivered by Tyndall staff. Access to equipment is also available for qualified industry personnel who wish to conduct the work themselves in a Tyndall laboratory.

The following are just some of the customers that use Tyndall services: United Technologies, Farran Technology, Analog Devices, Xenics, University of Leeds, Imperial College London,  all-Island of Ireland Univsersities.....

A summary of all the services and equipment available for use at Tyndall is provided under the Services section of this website. Here are the direct links:

  • Modelling
  • IC Design
  • Wafer Fabrication
  • Assembly/ Packaging
  • Reliability Environmental Testing
  • Reverse Engineering & Failure Analysis of Electronic Assemblies.
  • Test & Measurement
  • FIB Re-Engineering & Failure Analysis
  • IP Investigation