The Integrated Photonics Group is part of the Tyndall National Institute, and is affiliated with the Department of Physics at University College Cork. The group was created in late 2007 with Science Foundation Ireland support to complete the portfolio of Photonic research in Ireland. The Integrated Photonics Group seeks to work with both academia and industry in bridging the gap from Photonic materials and devices to Photonic Systems and applications. The core team, led by Dr. Frank Peters andDr. Peter O’Brien, have many years of experience in academic and industrial photonics R&D groups which include the Jet Propulsion Laboratory (CalTech), U. C. Santa Barbara, Agilent Technologies and Infinera.
The extraordinary growth of internet traffic already requires interfaces in the core of the network operating at 100 Gbit/s and there is no sign that the rate of expansion will decrease. Manufacturing optical transceivers to deliver these phenomenal rates, for an acceptable cost and power consumption, requires the integration of multiple photonic devices within a single compact package. The Photonic Integration Group, working together with the III-V Materials and Devices group at Tyndall and with colleagues from Trinity College Dublin, have developed a suite of key building blocks for future integrated transceivers, including high speed data modulators and photoreceivers. The team is working to combine these devices to form new types of packaged, high speed photonic integrated circuits (PICs) and photonic subsystems, with an emphasis on reducing cost and increasing manufacturability through judicious use of ‘foundry compatible’ hybrid and monolithic integration techniques. Increasingly, the group is also applying its advanced technology to solve integration and packaging problems in photonic-based medical devices for future healthcare applications. The group also works closely with Irish Industry to commercialise its new technologies.
The group has two main research focuses, which are:
Monolithic Integration (high speed photonics and photonic integrated circuits)
Packaging (hybrid integration made up of photonic and electronic packaging)