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Leader in
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Sample 2
Photonics
Theory Pedro123
III-V & III-Nitride Materials
Devices
Electronics
Integration
Packaging
Communications (Photonic Systems)
Bio Photonics
CAPPA
III-V & III-Nitride materials
Research Groups
III-V Materials & Devices
Centre for Advanced Photonics & Process Analysis (CAPPA)
III-Nitride Materials
Epitaxy & Physics of Nanostructures
Integrated Photonics
Photonic Packaging
Photonic Systems Group
Photonics Theory
Bio Photonics
Micro & Nano Systems
Integrated Sensors & Actuators
Electrochemical Nanosensors for Animal Health
Surface-Enhanced Raman Spectroscopy
Electrochemical Sensing
Nanoporous Materials
Nano Materials Based Sensor
Nanowire
Gas Sensing
Radiation Sensors
Device & Systems for Radiation Dosimetry
MEMS Sensors
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Solar Energy Materials
Photonic Band Gap Materials
Roll-to-Roll Coating Technologies
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Integrated Magnetics
Power Management Circuits
Emerging Material & Devices
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Electrochemical Materials & Energy
Atomic Layer Deposition
Chemical Vapour Deposition
Anti-Microbial Surfaces
Modelling Atomic Layer Deposition
Mechanism of Alumina ALD
Clean-up of III-V Oxides
Multi-scale Simulation
Hafnia and Zirconia Precursors
Interfaces with Oxides
ALD of Silicon-Based Materials
Deposition of Copper Metal
Materials Modelling for Catalysis & Transparent Electrodes
Modified TiO2 Photocatalysts
Doped Ceria for Catalysis
Photocatalysis
Materials Theory
Transport and Atomic Structure in Semiconductor Alloys
Group IV Semiconductor Alloys
Dilute Nitrides
Silicon Nanowires
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Ultrafast Photoexcitation of Materials
Coherent Photons
Thermoelectric Materials
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Piezoelectrics Materials for Energy Harvesting & Sensing
Piezo MEMS
Piezo MEMS/BioMEMS
Energy Harvesting
Resonators
Smart Materials
Piezoelectrics
Magnetics
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Material Properities
Medical Applications
Smart Interconnect
Nano Interconnect
High Temperature Die Attach
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III-V
MLD
2D Materials & Devices
Micropower Systems & Nanomagnetics
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Thermo Electric Cooler
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SME's Innovation Partnership
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Lab on a Chip
Optical DNA Microarray Detection Platform
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Protein Detection on Chip
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RF MEMS
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Dry Electrodes
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Biomedical Microsystems
Flip Chip Interconnect
IC Design MCCI
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WSN (Wireless Sensor Networks)
Integrated Magnetics
EMAE (Electrochemical Materials and Energy)
ICT 4 Energy
Circuits & Systems
HSI (Hetrogenous Systems Integration)
LSI (Life Science Interface) ICT4Health
EIS (Electronic Instrumentation Systems)
MMS (Molecular Microsystems)
Sensing and Separation Group
NTG (Nano Technology)
AMSG (Advanced Materials & Surfaces)
Micropower Systems & Nanomagnetics
RF Systems on Chip
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ASCENT
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Jer Cotter - Equipment Engineer
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+353 (0)21 2346316
+353 (0)87-6293565
jer.cotter (at) tyndall (dot) ie
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