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B |
bio-phontonics |
<h3>Harnessing light for the Life Sciences</h3>
<p>Professor Andersson-Engels is recruited as the Group Head of the newly established Biophotonics@Tyndall Group based at the Tyndall National Institute. The Group has been set up with generous financial support and infrastructure support which provides fantastic opportunities for world-class research within biophotonics. The Group’s major focus will be to form close collaborations with clinicians, research centres and companies to accelerate biophotonics technology and rapidly deliver this new technology into the hands of health-care providers. Using photonics as a driver for the faster development and deployment of more accurate, less invasive diagnostic and treatment methods for cancer and other diseases, the ultimate aim of Biophotonics@Tyndall is to radically improve health outcomes for patients.<br />
<br />
Ireland is host to more than 350 medical technology companies, including 13 of the top 15 global med-tech companies, employing 25,000 people and exporting over €8 billion. <a href="http://www.ipic.ie/">IPIC</a> is engaging with these companies to explore the integration of photonics into their future products to improve functionality, performance and value.</p>
<p>System scale is a critical parameter for health applications, such as wearable diagnostics and surgical instruments and therefore miniaturisation is an absolute requirement to achieve deployable solutions. The opportunities for IPIC technology to impact the health sector is huge – enabling the transition of diagnostics from highly specialised reference laboratories, to local point-of-care settings, and potentially to wearable devices.</p>
<p>In addition the technology can be integrated onto surgical instruments to guide surgeons during procedures to improve patient outcome. Our core research programme in this area is focused on the development of compact optical sensors that can be integrated with instruments, wearable devices, implants, smart-phones or optical fibres and the development of flexible microleds for optogenetics. Potential applications here include retinal, neuroscience and heart stimulation. Examples of where this technology can be applied to a number of biophotonics platforms include: In body O2 tissue sensing, microfludics, optical coherence tomography (OCT). Our researchers are also leveraging the emerging science of silicon photonics and hybrid and monolithic integration technologies to dramatically reduce device size.</p>
<p>Scientific challenges being addressed here include: Integration of discrete light sources onto silicon based biosensors & the integration of photonics and electronics onto compact microfluidic devices. This research has already resulted in the integration of optical fibres onto arterial guidewires and the first generation of miniaturised fluorescence sensing modules for blood and hormone analysis.</p> |
92 |
Bio Photonics |
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| 2 |
C |
cappa |
<h3>Centre for Advanced Photonics & Process Analysis</h3>
<p><img alt="CAPPA – Centre for Advanced Photonics & Process Analysis" src="contentfiles/images/Research/Photonics/CAPPA/CAPPA_Tyndall_banner.jpg" style="height:485px; width:1500px" title="CAPPA – Centre for Advanced Photonics & Process Analysis" /></p>
<p style="text-align:justify"><strong>The Centre for Advanced Photonics & Process Analysis (CAPPA) is a research centre of <a href="http://www.cit.ie/" target="_blank" type="Cork Institute of Technology">Cork Institute of Technology</a>, conducting both applied and fundamental research on photonics for applications in areas as diverse as telecommunications, medical devices, food and pharmaceutical manufacturing. As part of the CIT@Tyndall partnership, several members of CAPPA are co-located in Tyndall National Institute, forming a group within Tyndall’s Photonics Centre.</strong></p>
<p style="text-align:justify">CAPPA is led by Dr. Guillaume Huyet, who is also the Head of the <strong><a href="http://www.cit.ie/aboutcit/facultiesandcolleges/engineering_science/physical-sciences" target="_blank" type="Dept. of Physical Sciences">Dept. of Physical Sciences</a></strong> at CIT. In Tyndall, CAPPA occupies three state-of-the-art labs, and major research strands include non-linear dynamics of lasers and ultrafast laser physics, and the understanding of the dynamics of novel semiconductor materials and devices.</p>
<p style="text-align:justify">Current research activities of CAPPA include:</p>
<ul style="margin-left:40px">
<li>Swept source lasers for Optical Coherence Tomography</li>
<li>Optical characterisation of semiconductor materials and devices (including ultrafast spectroscopy techniques such as Time-Resolved Photoluminescence and Pump-Probe Spectroscopy)</li>
<li>Design and implementation of photonic sensors, e.g. for medical device and process monitoring applications</li>
</ul>
<p style="text-align:justify">CAPPA’s main website is located at <a href="http://www.cappa.ie/" target="_blank" type="CAPPA Website">www.cappa.ie</a> - please visit this for more comprehensive information on CAPPA.</p>
<table align="center" border="0" cellpadding="4" cellspacing="4" style="width:640px">
<tbody>
<tr>
<td><a href="contentfiles/images/Research/Photonics/CAPPA/CAPPA_Group_10-12-15.jpg" target="_blank"><img alt="" src="contentfiles/images/Research/Photonics/CAPPA/CAPPA_Group_10-12-15.jpg" style="border-style:solid; border-width:0px; float:left; height:397px; margin:0px; width:600px" title="CAPPA Group" /></a></td>
</tr>
<tr>
<td style="text-align:center">
<h6 style="text-align: left;">The CAPPA group pictured outside the Blackrock Castle Observatory</h6>
</td>
</tr>
</tbody>
</table>
<h3 style="text-align:justify">CIT@Tyndall</h3>
<p style="text-align:justify">Cork Institute of Technology and Tyndall National Institute have a long history of collaboration, which goes back well over two decades. The early collaborations were mostly on a peer-to-peer basis, but as the research activity of both institutions grew and matured, it became clear that the full advantage of collaborations could only be achieved through closer cooperation. Hence, a formal Memorandum of Understanding (MoU) was established between Tyndall and CIT. This was officially launched in September 2008 by then Minister for Science & Education, Batt O’Keeffe, when he unveiled a commemorative plaque. More recently, the renewal of the MoU was marked by a ceremony in June 2014 attended by Seán Sherlock, Minister for Research & Innovation.</p>
<p style="text-align:justify">CAPPA accounts for the majority of CIT researchers based on-site in Tyndall. The group maintains three state-of-the-art labs and office space in Tyndall, and collaborates closely with Tyndall on major projects such as the <a href="http://www.ipic.ie/" target="_blank" type="IPIC">IPIC</a> research centre and the <a href="http://www.promis-itn.eu" target="_blank">PROMIS</a> EU Marie Sklowdowska-Curie Network. Tyndall also has strong collaborations with other groups in CIT, such as the NIMBUS Centre in the areas of embedded systems and energy.</p>
<p style="text-align:justify"> </p> |
93 |
CAPPA |
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| 3 |
C |
communications-photonic-systems |
<p>Professor Paul Townsend is the Director of IPIC, Head of the Photonics Centre at the Tyndall National Institute and Research Professor in the Department of Physics at University College Cork in Ireland.</p>
<p><iframe allowfullscreen="" frameborder="0" height="360" mozallowfullscreen="" src="https://player.vimeo.com/video/145883556?title=0&byline=0&portrait=0" webkitallowfullscreen="" width="640"></iframe></p>
<p>Guillaume Huyet is currently the Head of the Centre for Advanced Photonics & Process Analysis and Head of the Department of Physical Sciences at Cork Institute of Technology. He received his M.Sc. degree from ENS Lyon (France) in 1992 and his Ph.D. degree from the University of Nice Sophia Antipolis (France) in 1995. After postdoctoral positions in Mallorca (Spain), Cork (Ireland) and Glasgow (U.K.), he became a Lecturer at University College Cork (Ireland). He progressed to the level of Senior Research Fellow, and was head of the Photonic Device Dynamics Group in UCC’s Tyndall National Institute.</p>
<p><iframe allowfullscreen="" frameborder="0" height="360" mozallowfullscreen="" src="https://player.vimeo.com/video/142512574?title=0&byline=0&portrait=0" webkitallowfullscreen="" width="640"></iframe></p>
<p>Liam Barry received his BE (Electronic Engineering) and MEngSc (Optical Communications) degrees from University College Dublin in 1991 and 1993 respectively.</p>
<p><iframe allowfullscreen="" frameborder="0" height="360" mozallowfullscreen="" src="https://player.vimeo.com/video/142507110?title=0&byline=0&portrait=0" webkitallowfullscreen="" width="640"></iframe></p> |
91 |
Communications (Photonic Systems) |
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| 4 |
D |
devices |
<p>Brian Corbett is Group Leader III-V materials and devices. His primary interest is in the use of structuring techniques to achieve enhanced function and performance </p>
<p><iframe allowfullscreen="" frameborder="0" height="360" mozallowfullscreen="" src="https://player.vimeo.com/video/145868183?title=0&byline=0&portrait=0" webkitallowfullscreen="" width="640"></iframe></p> |
87 |
Devices |
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| 5 |
E |
electronics |
<p>Dr. Peter Ossieur received the PhD degree in electronic engineering from Ghent University in 2005. From 2005 till 2008 he was a postdoctoral research fellow funded by the Fund for Scientific Research, Belgium. In 2008, he became assistant professor, high-speed electronics at Ghent University, Belgium and in 2009, he joined Tyndall National Institute as a senior postdoctoral researcher. In 2011 he became a Staff Researcher at Tyndall, and in 2013 Senior Staff Researcher. His main research interest is high-speed electronics for photonic applications. He was and is active in many EU-funded projects such as PLAT4M, Fabulous, DISCUS, VISIT, C3PO, VISIT and EuroFOS. He has authored or co-authored over 80 publications and holds 2 patents in the field of high-speed electronics and fibre optics<br />
</p>
<p><iframe allowfullscreen="" frameborder="0" height="360" mozallowfullscreen="" src="https://player.vimeo.com/video/146328655?title=0&byline=0&portrait=0" webkitallowfullscreen="" width="640"></iframe></p> |
88 |
Electronics |
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| 6 |
E |
emerging-material-and-devices |
<h3 style="text-align: justify;"><img alt="Emerging Materials & Devices" height="502" src="contentfiles/images/Research/Emerging Materials & Devices/EMD_banner.jpg" width="2000" /></h3>
<p style="text-align:justify"><strong>New materials and new devices are at the core of Tyndall research. Advances in technology depend on integrating new materials often in novel ways, so as to improve the electronic, optical, magnetic, thermal or chemical performance of devices. We focus in particular on meeting the demand for faster electronic devices that at the same time consume less power. </strong></p>
<p style="text-align:justify">We are researching sustainable ways to generate and store energy through photocatalytic, thermoelectric, piezoelectric, electromagnetic and hybrid transduction techniques. We also develop smart materials that interact with their environment in a controlled way, such as sensors and anti-microbials.</p>
<p style="text-align:justify"><img alt="" height="187" src="contentfiles/images/Research/Emerging Materials & Devices/EMD_image.jpg" style="float:right" width="230" />At Tyndall we have the expertise to identify technology needs and then design and optimise solutions, through selecting materials, structuring them and combining them, often at the nanoscale. To do this, we bring together specialists in atomic-scale to device-scale modelling, materials processing and characterisation, including particular strengths in electrical and magnetic characterisation. </p>
<p style="text-align:justify">We are using simulation and experiment to develop new techniques for depositing materials with atomic-level control and fabricating devices at the micro to nano-scale. We benefit from Tyndall’s comprehensive device fabrication facilities: it is crucial that we can process materials in the laboratories at Tyndall and can then transfer the technique to a realistic production environment, such as the clean room for wafer-scale batch-fabrication of devices.</p> |
113 |
Emerging Material & Devices |
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| 7 |
E |
eu-programmes |
<h3><em>Transforming Research to Innovation with Impact</em></h3>
<p style="text-align:justify"><strong>Our objective at the EU Programmes Office in Tyndall is to enhance our EU collaborative research across the whole innovation chain, thereby achieving industry growth and benefits for the society at large. </strong></p>
<figure class="image" style="float:right"><img alt="EU Research Investment" height="690" src="contentfiles/images/Research/Strategic_Programmes/EU_image01.png" width="1135" />
<figcaption>Tyndall, as a research and technology organization, has taken a proactive role to double Europe’s research investment in Ireland and to work with technology adopters to bridge the so-called valley of death.</figcaption>
</figure>
<p style="text-align:justify">Our extensive network builds on partnerships with over 400 organisations to deliver value across several European programmes including Horizon 2020, Public-Private-Partnerships and the European Regional Development Fund. Since the launch of Horizon 2020 in 2014, Tyndall participates in 26 projects with total value of ca. €150m out of which the European Commission contributes 70%. The rest is largely matched by the industrial partners. </p>
<p style="text-align:justify">The investment in Tyndall activities within the projects is valued at €12.8m. An additional €13m funding to our Irish partners, incl. €9 to industry (translating to over 40 jobs p.a.), is also proof of Tyndall’s active role as a research and technology organization in doubling Europe’s research investment in Ireland and in working with technology adopters to bridge the so-called valley of death.</p>
<figure class="image" style="float:left"><img alt="ASCENT (Access to European Nanoelectronics Network)" height="318" src="contentfiles/images/Research/Strategic_Programmes/EU_image02.png" width="450" />
<figcaption>Tyndall, as coordinator, CEA-Leti (FR) and imec (BL), leading European nanoelectronics institutes, have entered into a collaborative open-access project called <a href="http://www.ascent.network/">ASCENT</a> (Access to European Nanoelectronics Network), to mobilise European research capabilities like never before and build a collaborative nanoelectronics community.</figcaption>
</figure>
<p style="text-align:justify">In 2015, three major projects were launched that link new scientific knowledge with application-driven research to create high-impact innovations.<br />
</p>
<p style="text-align:justify"> </p>
<p style="text-align:justify"> </p>
<h2>Coordinated Projects</h2>
<p><a href="http://www.ascent.network/" target="_blank">ASCENT</a><br />
<a href="http://www.european-ald.net/" target="_blank">Herald</a><br />
<a href="http://cordis.europa.eu/project/rcn/194305_en.html" target="_blank">TOP HIT</a><br />
<a href="http://www.tips2020.eu" target="_blank">TIPS</a><br />
<a href="http://cordis.europa.eu/project/rcn/106775_en.html" target="_blank">ALBATROSS</a><br />
<a href="http://www.nmp-deepen.eu/">DEEPEN</a><br />
<a href="http://www.themanpowerproject.eu/" target="_blank">MANPOWER</a><br />
</p>
<p style="text-align:justify"> </p>
<p style="text-align:justify"> </p>
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<p> </p>
<h4>Related Projects</h4>
<p> </p>
<p><strong>ASCENT: <a href="http://www.ascent.network" target="_blank">www.ascent.network</a></strong></p>
<p><strong>GateOne: <a href="http://www.gateone-project.eu" target="_blank">www.gateone-project.eu</a></strong></p>
<p><strong>SMARTER-SI: <a href="http://www.smart-systems-integration.org/smarter-si" target="_blank">www.smart-systems-integration.org/smarter-si</a></strong></p>
<p><strong>HERALD: <a href="http://www.european-ald.net" target="_blank">www.european-ald.net</a></strong></p>
<p> </p>
<p>TOP HIT: <a href="http://cordis.europa.eu/project/rcn/194305_en.html" target="_blank">cordis.europa.eu/project/rcn/194305_en.html</a></p>
<p>TIPS: <a href="http://www.tips2020.eu">www.tips2020.eu</a> </p>
<p>ALBATROSS: <a href="http://cordis.europa.eu/project/rcn/106775_en.html" target="_blank">cordis.europa.eu/project/rcn/106775_en.html</a></p>
<p>DEEPEN: <a href="http://www.nmp-deepen.eu" target="_blank">www.nmp-deepen.eu</a></p>
<p>MANPOWER: <a href="http://www.themanpowerproject.eu" target="_blank">www.themanpowerproject.eu</a></p>
<p> </p>
<h4>Core Team</h4>
<ol>
<li>Giorgos Fagas</li>
<li>Martin O’Connell</li>
<li>Aoife O’Brien</li>
<li>David Williams</li>
</ol>
<p> </p>
<h4>Contact</h4>
<p>Giorgos Fagas</p>
<p> </p>
<p> </p>
<h4>Related Research</h4>
<p> </p>
<p>GateOne: http://www.gateone-project.eu/</p>
<p>SMARTER-SI: http://www.smart-systems-integration.org/smarter-si</p>
<p>MOEEBIUS: http://www.moeebius.eu/</p>
<p>CARDIS: http://cordis.europa.eu/project/rcn/194245_en.html</p>
<p>INSIGHT: http://insight.eit.lth.se/ </p>
<p>OCTCHIP: http://www.octchip.researchproject.at/</p>
<p>PIX4LIFE: http://pix4life.eu/</p>
<p>AUTOSTEM: http://www.autostem2020.eu/ </p>
<p>HISENTS: http://cordis.europa.eu/project/rcn/200813_en.html</p>
<p>ROCSAFE: link not available yet</p>
<p>Informed: http://informed-project.eu/</p>
<p>Nanorestart: http://www.nanorestart.eu/</p>
<p>SWIM-ing: http://swiming-project.eu/</p>
<p>NEREID: https://www.nereid-h2020.eu/</p>
<p>NanoStreeM: http://cordis.europa.eu/project/rcn/200552_en.html</p>
<p>SaSHa: not available yet</p>
<p>ProACT: http://proact2020.eu/</p>
<p>CHEOPS: http://www.cheops-project.eu/</p>
<p>PLAT4M: http://plat4m-fp7.eu/</p>
<p>ICT-ENERGY: http://www.ict-energy.eu/</p>
<p>PIEZOMAT: http://www.piezomat.eu/</p>
<p>COMPOSE3: http://cordis.europa.eu/project/rcn/111144_en.html</p>
<p>RAPIDO: http://www.rapido-project.eu/</p>
<p>CARRICOOL: www.carricool.eu/</p>
<p>PLIANT: http://cordis.europa.eu/project/rcn/106912_en.html</p>
<p>COMMON SENSE: http://www.commonsenseproject.eu/</p>
<p>ALBATROSS: http://cordis.europa.eu/project/rcn/106775_en.html</p>
<p>SAFESENS: http://eniac-safesens.eu/</p>
<p>GIFT: http://cordis.europa.eu/project/rcn/192217_en.html</p>
<p>RAPID: http://www.rapid-itn.eu/</p>
<p>ACTPHAST: http://www.actphast.eu/</p>
<p>BIOGO: http://www.biogo.eu/</p>
<p> </p>
<p> </p>
<h4>Key People</h4>
<ul>
<li>Kieran Drain (EARTO Board)</li>
<li>Giorgos Fagas (ESFRI Phys. Sci. & Eng., AENEAS Scientific Council, EPoSS Key Technologies, ENI2)</li>
<li>Paul Galvin (ETP Nanomedicine Int. Chair on MedTech, ESSC Leader on Health Monitoring and Comfort Sensors, AIOTI Wearables, EPIC Biophotonics)</li>
<li>Jim Greer (EMMC)</li>
<li>Alan Mathewson (ENI2)</li>
<li>Eric Moore (EPoSS Co-Chair Applied MNBS)</li>
<li>Ann O’Connell (EuMaT)</li>
<li>Cian O’ Mathuna (EPoSS Executive Committee)</li>
<li>Paul Townsend (Photonics21 Board)</li>
</ul>
--> |
127 |
EU Programmes |
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| 8 |
I |
ic-design-mcci |
<h3>Microelectronics Circuits Centre Ireland</h3>
<p><img alt="MCCI Logo" height="122" src="contentfiles/images/Research/IC Design MCCI/New MCCI Logo.png" width="440" /></p>
<h2 style="text-align:justify"><strong>Integrated Circuits Design at Tyndall</strong></h2>
<p style="text-align:justify"><strong>The vision for integrated circuits design research at Tyndall is to grow MCCI, into a world leading industry led analogue-mixed-signal circuits research Centre by 2020. The mission is to increase the relevance to industry of circuit research carried out in HEIs, by making IP more accessible to industry, by increasing the quality of circuit research carried out by the HEIs and by increasing the scale of relevant research carried out in the HEIs, leading to increased exports revenue & employment. </strong></p>
<p style="text-align:justify">MCCI competes in terms of scale and quality with the top academics groups in analog and mixed-signal circuits worldwide. We are an exemplar for how industry can best lead and benefit from interaction with academic research groups in the field.</p>
<p style="text-align:justify">MCCI is focusing on applications that are of long term societal benefit in Med Tech, Smart Agri and future Communications, while maintaining a close alignment with multiple industry partners. We are working on building up a dynamic, recognisable research leadership team. And it’s a great place to work! </p>
<p style="text-align:justify"> </p>
<h5 style="text-align:justify"><strong>Data Converters</strong></h5>
<p style="text-align:justify">The Data-Converters area focuses on calibration and self-test of data-converters including associated very low jitter clocking. We are carrying out research on ADCs with an emphasis on improved FOM for existing converters as well as pushing the data throughput envelope for converters aimed at very wide bandwidth applications. MCCI very low jitter clocking research looks at LCVCO PLL and All-Digital PLLs for use with RF and high speed data-converters.</p>
<p style="text-align:justify"> </p>
<h5 style="text-align:justify"><strong>Power Management</strong></h5>
<figure class="image" style="float:right"><img alt="Donnacha O’Riordan and Ivan O’Connell with Chip" height="261" src="contentfiles/images/Research/IC Design MCCI/DOR and IOC with chip.jpg" width="360" />
<figcaption>Donnacha O’Riordan and Ivan O’Connell with Chip</figcaption>
</figure>
<p style="text-align:justify">The Power Management area focuses on novel power supply design for use in multi-rail SoCs emphasising efficiency increases with BOM cost reduction. It includes new charge pump and regulator architectures, adapting the power supply to current environment, advanced digital control loops for multi-rail switching converters and high frequency switching converters for Power-Supply-on-Chip.</p>
<p style="text-align:justify"> </p>
<h5 style="text-align:justify"><strong>Transceivers</strong></h5>
<p style="text-align:justify">The High Frequency Transceivers area focuses on mmWave radio SoC, highly digitized multi-mode RF transceivers and high speed optical communications transceivers. MCCI mmWave radio research covers topics such as E-band and radiometers at 95GHz in deep-sub-micron CMOS. Multi-mode radio addresses challenges in multi-standard RF Front-ends, synthesizers, LNA and PA on CMOS. High speed optical transceivers looks at circuits for optical communications above 25Gbps.</p>
<p> </p> |
106 |
IC Design MCCI |
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| 9 |
I |
ict4energy-efficiency |
<h3>Using ICT to Enable Energy Efficiency</h3>
<figure class="image" style="float:right"><img alt="Indoor Solar Powered WSN" height="113" src="contentfiles/images/Research/Strategic_Programmes/ICT4EE_01.jpg" width="165" />
<figcaption>Indoor Solar Powered WSN</figcaption>
</figure>
<p style="text-align: justify;"><strong>‘ICT4EE’ is an industry oriented group at Tyndall with a mission statement that is embedded in its group name, identifying and exploiting ICT opportunities to improve energy efficiency in buildings, micro-grids and smart cities. At the heart of this lies a ‘one stop shop’ based on the following enabling technologies for IoT devices that are developed and system integrated in close collaboration with other Tyndall groups and with academic and industry partners and associations.</strong></p>
<p style="text-align: justify;">WSN (Wireless Sensors Networks) – IoT devices and systems can be retrofitted into new and existing equipment and infrastructure. This enables data to be gathered to help with deciding on how energy savings can be made and renewable energies seamlessly and efficiently integrated. It can also be used undertake conditional monitoring of equipment i.e. to enable predictive maintenance.</p>
<figure class="image" style="float:left"><img alt="Endeco WSN Sensing and Actuation Platform" height="119" src="contentfiles/images/Research/Strategic_Programmes/ICT4EE_02.jpg" width="299" />
<figcaption>
<p style="text-align: justify;">Endeco WSN Sensing and Actuation Platform</p>
</figcaption>
</figure>
<p style="text-align: justify;">Energy Harvesting – eliminating the need for battery replacement in IoT devices or at least extending their battery life through careful power management coupled with identifying and maximizing use of ambient energies in a given application environment. The group specializes in development of application specific power management solutions (simulation models and hardware) and system integration of Tyndall and OEM transducers and storage devices.</p>
<p style="text-align: justify;">PSiP & PwrSoc – PSiP (power supply in package) entails embedding power electronics in multi-chip modules along with sensors, transceivers and other components found in IoT devices. PwrSoC (power supply on chip) comprises embedding circuits and components onto Silicon where possible. This is critical for reducing power consumption, energy harvesting compatibility and form factor of IoT devices for as well as improving their robustness.</p>
<figure class="image" style="float:right"><img alt="MOSYCOUSIS Multi-Source Energy Harvester" height="134" src="contentfiles/images/Research/Strategic_Programmes/ICT4EE_03.jpg" width="182" />
<figcaption>MOSYCOUSIS Multi-Source Energy Harvester</figcaption>
</figure>
<p> </p>
<p><strong>Tyndall ICT4EE - Key Achievements</strong></p>
<ul>
<li>World’s 1<sup>st</sup> open source power management solution self-powering wireless sensors indefinitely using just indoor lighting, capable of operating for 72 hours in darkness (SFI ITOBO project).</li>
<li>1st known tool for assisting in planning development and deployment of energy harvesting powered WSN devices in real life applications (IERC ROWBUST project).</li>
<li>WSN platform for sensing and actuation of refrigeration and lighting systems in retail application developed for and licensed to Endeco Technologies, an Irish SME, demonstrating 19% energy savings in a retail application (EI innovation partnership).</li>
</ul>
<p> </p>
<p><strong>Tyndall ICT4EE profile</strong></p>
<ul>
<li>20+ person years of effort & 100+ person years of experience.</li>
<li>>€6M investment accrued over 8 years for Tyndall and Irish industry partners.</li>
</ul>
<figure class="image" style="float:right"><img alt="ROWBUST Simulation Tool" height="256" src="contentfiles/images/Research/Strategic_Programmes/ICT4EE_04.jpg" width="466" />
<figcaption>ROWBUST Simulation Tool</figcaption>
</figure>
<p><strong>WSN</strong></p>
<ul>
<li>Multi-radio platforms for micro-grid applications (current clamps, gateways, meter interfaces, multi-sensor nodes) developed on EU projects GreenCom & ME3Gas and Irish government funded projects ITOBO (SFI) & BuildWise (EI).</li>
</ul>
<p> </p>
<p><strong>Energy Harvesting</strong></p>
<ul>
<li>Multi-source Energy harvesting platform capable of delivering 2mW and self-powering a conditional monitoring diagnostic unit for cold room applications (MOSYCOUSIS).</li>
<li>Multi-source energy harvesting IC (in development) in collaboration with MCCI (www.mcci.ie) incorporating self start, extremely wide input voltage range at ultra-low ambient energies (EI funded MISCHIEF project 2015-2017).</li>
</ul>
<p> </p>
<p><strong>PSiP/PSoC</strong></p>
<ul>
<li>Tyndall is an active member of PSMA (Power Sources Manufacturing Association) packaging, magnetics & energy harvesting committees and promotes system level synergies between these disciplines.</li>
<li>The 2014 3D packaging technology roadmap commissioned by PSMA was undertaken by Tyndall (add weblink?) and launched at APEC 2014.</li>
</ul>
<p> </p>
<p><strong>Multidisciplinary Research Capability</strong></p>
<ul>
<li>Hardware design (WSN and power management circuits), Energy harvesting and storage systems (circuits, devices and models), PWrSoc and PSiP embedding of active and passive components, WSN and energy Harvesting system deployments for energy efficiency, internal and external collaborations from devices to systems.</li>
</ul>
<p> </p> |
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ICT4Energy Efficiency |
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ict4health |
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125 |
ICT4Health |
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materials |
<h3>Semiconductors; OptoElectronic device structures; Quantum Wells, Wires and Dots; Nanostructured epitaxy</h3>
<p style="text-align: justify;">From atoms to system is the mission of both Tyndall and Photonics in Tyndall. The aspiration of encompassing the full technological chain for the development of advance optoelectronic devices has encouraged the Institute to seed to research <img alt="" src="contentfiles/images/Research/Photonics/III-V & III-NITRIDE MATERIALS/Nitrides.jpg" style="height:424px; margin:8px; width:424px; float:right" />groups specialized in the epitaxial growth of semiconductor materials of the III-V family. These two groups (head by Prof. Parbrook and Dr. Pelucchi) are specialised in large bandgap nitride semiconductor materials (e.g. GaN, InGaN) and conventional III-Vs for telecom applications (e.g. GaAs, InGaAS, InP). Two metalorganic vapour phase epitaxy systems (MOVPE) guarantee a broad coverage of material compositions and capabilities. The two groups are also part of the <a href="http://www.ipic.ie/">Irish Photonic Integration Centre</a>.</p>
<p><iframe allowfullscreen="" frameborder="0" height="360" mozallowfullscreen="" src="https://player.vimeo.com/video/142504411?title=0&byline=0&portrait=0" webkitallowfullscreen="" width="640"></iframe></p> |
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III-V & III-Nitride Materials |
From atoms to system is the mission of both Tyndall and Photonics in Tyndall. The aspiration of encompassing the full technological chain for the development of advance optoelectronic devices has encouraged the Institute to seed to research Click and drag to movegroups specialized in the epitaxial growth of semiconductor materials of the III-V family |
| 12 |
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iii-v-and-iii-nitride-materials |
<h3>Semiconductors; OptoElectronic device structures; Quantum Wells, Wires and Dots; Nanostructured epitaxy</h3>
<p style="text-align: justify;"><img alt="" src="contentfiles/images/Research/Photonics/Nitrade01.jpg" style="float:right; height:231px; margin:8px; width:240px" />From atoms to system is the mission both of Tyndall and Photonics in Tyndall. The aspiration of encompassing the full technological chain for the development of advance optoelectronic devices has encouraged the Institute to seed to research groups specialized in the epitaxial growth of semiconductor materials of the III-V family. These two groups (head by Prof. Parbrook and Dr. Pelucchi) are specialized in large bandgap nitride semiconductor materials (e.g. GaN, InGaN) and conventional III-Vs for telecom applications (e.g. GaAs, InGaAS, InP). Two metalorganic vapour phase epitaxy systems (MOVPE ) guarantee a broad coverage of material compositions and capabilities.</p>
<p>The two groups are also part of the <strong><a href="http://www.ipic.ie/" target="_blank" type="Irish Photonic Integration Centre">Irish Photonic Integration Centre</a></strong></p>
<p> </p>
<p><img alt="" src="contentfiles/images/Research/Photonics/Nitrade02.jpg" style="height:747px; width:991px" title="" /></p> |
480 |
III-V & III-Nitride materials |
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sensors |
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Integrated Sensors & Actuators |
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integration |
<h3>Monolithic Photonic Integration</h3>
<p>The Monolithic Integration effort within the Integrated Photonics Group works with both academia and industry in bridging the gap from Photonic materials and devices to Photonic Systems and applications. The team actively pursues research and development in high speed Photonics, and Photonic Integrated Circuits. The core team is led by Prof. Frank Peters who has many years of experience in academic and industrial photonics R&D groups which include U. C. Santa Barbara, Agilent Technologies and Infinera. Within Tyndall, the team works closely with the photonic materials and devices teams for device development, and with the packaging and communication teams to prove practical working demonstrations.</p>
<p>The main focus of the group is to enable very high information spectral density (ISD) coherent communications. This requires high speed photonic devices to create and receive the signals, as well as optical circuits designed to generate and manipulate coherent comb lines. The group includes expertise in photonic and laser theory, simulations, design, fabrication and characterization; all of which are required to pursue our research. Current areas of active research include coupled lasers on photonic integrated circuits (PICs), generation and manipulation of coherent optical combs, low linewidth and tunable single mode lasers on PICs, high speed optical modulators (both EAMs and MZMs), and high density multi-layer RF connections for packaging of PICs.</p>
<p>To support our research we have developed custom device design and characterization capabilities including: beam propagation analysis, quantum well design for modulators, custom masks design software (PICDraw), multiple photonic probe stations for die level characterization, high speed characterization of photonic devices up to 65 GHz and 56 Gbps. </p>
<p> </p>
<p><iframe allowfullscreen="" frameborder="0" height="360" mozallowfullscreen="" src="https://player.vimeo.com/video/142512573?byline=0&portrait=0" webkitallowfullscreen="" width="640"></iframe></p> |
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packaging |
<p>Professor Peter O’Brien received his PhD in physics from University College Cork (Ireland) in 1999. He was a postdoctoral scholar at the California Institute of Technology (US) and NASA’s Jet Propulsion Laboratory (US). In 2006, he founded Epi-Light Ltd. – a photonics company developing specialty optical systems for medical device and bio-imaging applications – selling the company in 2009, and returning to Tyndall to establish an advanced photonic packaging and integration group. Today, the group has grown to 20 researchers, and is involved in a wide range of academic and industry-funded projects, with a special focus on packaging and integration for silicon-photonics devices. Prof. O’Brien works to develop photonic packaging standards and to support photonic-packaging for the ePIXfab and EuroPractice silicon-photonic foundries. He is deputy director of IPIC – the Irish Photonic Integration Centre (www.ipic.ie) – that recently received €30M of funding from Science Foundation Ireland.</p>
<iframe src="https://player.vimeo.com/video/147010196?title=0&byline=0&portrait=0" width="640" height="360" frameborder="0" webkitallowfullscreen mozallowfullscreen allowfullscreen></iframe> |
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Packaging |
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Research Groups |
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services |
<h3> </h3>
<p><img alt="Services" height="388" src="contentfiles/images/Services/services_banner.jpg" width="1500" /></p>
<p style="text-align:justify"><strong>The objective of SP&S is to best cater for all customer needs, and to substantially increase industrial revenues while continuing to develop leading edge process technologies and devices in collaboration with Tyndall researchers.</strong></p>
<p style="text-align:justify">The centre composes cover frontend activities encompassing cleanroom fabrication and training facilities as well as back-end Device Forensics activities including analysis, test, reverse engineering, packaging and reliability. The emerging Internet of Things (IoT) market has created a need to closely integrate analogue sensors with simple CMOS circuitry to digitally ‘polish’ the signals.</p>
<p style="text-align:justify">Our flexible fabrication offering, FlexiFab, is in a unique position to allow for greater material exchange between the fabrication areas, whilst maintaining protocols to avoid cross contamination. The flexible exchange of materials and devices on offer here across the functional areas of CMOS, MEMs and Compound Semiconductor (FlexiFab) is unique in industrially accessible fabrication facilities. This enables the type of material integration essential for the More than Moore and IoT domains, where advanced sensors are made network aware. Our extensive ‘back-end’ facilities and expertise enable us to take the resulting functionalised devices and package them in a form that enables the customer to use them in their real world systems. Coupled with this are capabilities in reliability testing, reverse engineering, electron microscopy and analysis which together provide the diagnostic tools that allow for the forensic analysis of materials and devices.</p>
<h2 style="text-align:justify"><br />
<strong>Process & Product Development</strong></h2>
<p style="text-align:justify"><strong>Tyndall’s extensive fabrication facilities cover:</strong></p>
<ul style="margin-left:80px">
<li>Silicon MOS Fabrication</li>
<li>MEMS Fabrication</li>
<li>Compound Semiconductor Fabrication</li>
<li>Training Facility</li>
<li>E-Beam Lithography</li>
<li>Flexifab</li>
</ul>
<p style="text-align:justify">There is a flexible exchange of materials and devices across the functional areas of CMOS, MEMs and Compound Semiconductor (Flexifab) which is unique in industrially accessible fabrication facilities. This enables the type of material integration which is essential for the More than Moore and IoT domains where advanced sensors are made network aware.</p>
<p style="text-align:justify">The resulting functionalised devices are transferred into the Device Forensics area for packaging, analysis, reliability and test.</p>
<h2><br />
<strong>Device Forensics</strong></h2>
<p style="text-align:justify">Complementing the ‘front-end’ fabrication capabilities, Tyndall has extensive ‘back-end’ facilities and expertise to be able to take the functionalised devices and package them in a form that enables the customer to use them in their real world systems. Married with this are capabilities in reliability testing, reverse engineering, electron microscopy and analysis which together provide the diagnostic tools that allow for the forensic analysis of materials and devices.<br />
<br />
<strong>The particular capabilities cover the areas of:</strong></p>
<ul style="margin-left:80px">
<li>Electronic Packaging & Reliability analysis – wire/die bond, PCB assembly, µBGA. Environmental testing, package & failure analysis, burn-in, shock & drop, X-ray analysis</li>
<li>Electron Microscopy Analysis Facility (EMAF) – SEM, TEM, FIB, EDAX analysis, cryo-stage enabled SEM for biological sample analysis.</li>
<li>​DTE – IC re-engineering, patent infringement, circuit design analysis, analogue, digital & mixed signal diagnostic measurements.<br />
</li>
</ul>
<p> </p>
<p> </p>
<p><iframe allowfullscreen="" frameborder="0" height="315" src="https://www.youtube.com/embed/hcdFEUjBrWo" width="560"></iframe></p>
<p> </p>
<p> </p> |
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systems-integration |
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Smart Systems Integration |
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theory |
<p>Eoin O’Reilly’s research seeks to improve the fundamental understanding of photonic materials and devices, to enable the design of structures for new capabilities and applications.<br />
</p>
<p><iframe allowfullscreen="" frameborder="0" height="360" mozallowfullscreen="" src="https://player.vimeo.com/video/142521489?title=0&byline=0&portrait=0" webkitallowfullscreen="" width="640"></iframe></p> |
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Eoin O’Reilly’s research seeks to improve the fundamental understanding of photonic materials and devices, to enable the design of structures for new capabilities and applications. |
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