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Leader in Integrated ICT Hardware & Systems
| Funder | Start Date | End Date | Title | Role |
|---|---|---|---|---|
| Enterprise Irl | 01-NOV-02 | 31-OCT-05 | [EI ATRP/02/415B] {Stam, Frank} N | Principal Investigator |
| European Union | 01-SEP-10 | 30-OCT-14 | Microsystem integration based on electroactive polymer gels for cardiovascular applications. | Principal Investigator |
| Enterprise Irl | 22-JUN-09 | 02-NOV-09 | EI Travel Support FP7 ICT02009-5 | Principal Investigator |
| Enterprise Irl | 01-JAN-02 | 31-DEC-03 | [EI REF: ATRP/01/336] {Stam, Dr. F} N | Principal Investigator |
| Enterprise Irl | 04-JUN-10 | 30-JUN-12 | EI FP/2010/674 Travel Support | Principal Investigator |
| Enterprise Irl | 23-FEB-10 | 23-MAY-10 | Travel Support | Principal Investigator |
| Enterprise Irl | 01-OCT-00 | 30-SEP-02 | [EI Contract ST/2000/053]{Stam,Dr.F.} N | Principal Investigator |
| Enterprise Irl | 01-JAN-15 | 31-MAR-18 | INCITE IR-2015-0029 | Principal Investigator |
| Year | Publication |
|---|---|
| 1991 | Preliminary Study on Developing an Expert System for Tape Automated Bonding M. F. Ahmad, W.G. Sullivan (1991) Preliminary Study on Developing an Expert System for Tape Automated Bonding . : CRC Press. |
| Year | Journal | Publication |
|---|---|---|
| 2016 | Sensors and Actuators A-Physical | Widening the bandwidth of vibration energy harvesters using aliquid-based non-uniform load distribution Nathan Jackson, Frank Stam, Oskar Olszewski, Hugh Doyle, Aidan Quinn, Alan Mathewson (2016) Widening the bandwidth of vibration energy harvesters using aliquid-based non-uniform load distribution. : . [Details] |
| 2016 | Thin Solid Films | Crystallinity and mechanical effects from annealing Parylene thin films Jackson, N;Stam, F;O'Brien, J;Kailas, L;Mathewson, A;O'Murchu, C (2016) Crystallinity and mechanical effects from annealing Parylene thin films. : ELSEVIER SCIENCE SA. [Details] |
| 2016 | Analytical Letters | Evaluation of a Gelatin Modified Poly(ɛ-Caprolactone) Film as a Scaffold for Lung Disease Aleksandra Kosmalaa, Michelle Fitzgerald, Eric Moore, Frank Stam (2016) Evaluation of a Gelatin Modified Poly(ɛ-Caprolactone) Film as a Scaffold for Lung Disease. : . [Details] |
| 2015 | IEEE Transactions On Biomedical Engineering | A Cardiovascular Occlusion Method Based on the Use of a Smart Hydrogel Jackson, N,Verbrugghe, P,Cuypers, D,Adesanya, K,Engel, L,Glazer, P,Dubruel, P,Shacham-Diamand, Y,Mendes, E,Herijgers, P,Stam, F (2015) A Cardiovascular Occlusion Method Based on the Use of a Smart Hydrogel. : . [Details] |
| 2015 | Advances In Polymer Technology | Electromechanical Properties of Carbon Nanotube Infused Polyacrylamide Hydrogel Jackson, N;Sheehan, A;Hasan, M;Stam, F;Razeeb, KM (2015) Electromechanical Properties of Carbon Nanotube Infused Polyacrylamide Hydrogel. : WILEY-BLACKWELL. [Details] |
| 2015 | Journal of applied polymer science | Optimization of electrical stimulation parameters for electro-responsive hydrogels for biomedical applications Jackson, N;Stam, F (2015) Optimization of electrical stimulation parameters for electro-responsive hydrogels for biomedical applications. : WILEY-BLACKWELL. [Details] |
| 2015 | Journal Of Materials Science | An electro-responsive hydrogel for intravascular applications: an in vitro and in vivo evaluation Verbrugghe P, Verhoeven J, Coudyzer W, Verbeken E, Dubruel P, Mendes E, Stam F, Meuris B, Herijgers P (2015) An electro-responsive hydrogel for intravascular applications: an in vitro and in vivo evaluation. : . [Details] |
| 2014 | Journal of applied polymer science | Optimization of electrical stimulation parameters for electro-responsive hydrogels for biomedical applications Jackson, Nathan and Stam, Frank (2014) Optimization of electrical stimulation parameters for electro-responsive hydrogels for biomedical applications. : . |
| 2014 | IEEE Transactions On Biomedical Engineering | A cardiovascular occlusion method based on the use of a smart hydrogel Nathan Jackson, P. Verbrugghe, D. Cuypers, K. Adesanya, L. Engel, P. Glazer, P. Dubruel, Y. Shacham-Diamand, E. Mendes, P. Herijigers, F. Stam (2014) A cardiovascular occlusion method based on the use of a smart hydrogel. : . |
| 2013 | Ieee Transactions On Components Packaging And Manufacturing Technology | High-Temperature Die-Attach Technology for Power Devices Based on Thermocompression Bonding of Thin Ag Films Smet, V,Jamal, M,Waldron, F,Stam, F,Mathewson, A,Razeeb, KM (2013) High-Temperature Die-Attach Technology for Power Devices Based on Thermocompression Bonding of Thin Ag Films. : . [Details] |
| 2013 | Microelectronics Reliability | Mechanical assessment of an anisotropic conductive adhesive joint of a direct access sensor on a flexible substrate for a swallowable capsule application Jesudoss, P,Mathewson, A,Wright, WMD,Stam, F (2013) Mechanical assessment of an anisotropic conductive adhesive joint of a direct access sensor on a flexible substrate for a swallowable capsule application. : . [Details] |
| 2013 | Journal Of Polymer Science Part B-Polymer Physics | 3-D Interdigitated electrodes for uniform stimulation of electro-responsive hydrogels for biomedical applications Jackson, Nathan and Cordero, Nicolas and Stam, Frank (2013) 3-D Interdigitated electrodes for uniform stimulation of electro-responsive hydrogels for biomedical applications. : . [Details] |
| 2013 | Microelectronics Reliability | Mechanical assessment of an anisotropic conductive adhesive joint of a direct access sensor on a flexible substrate for a swallowable capsule application Jesudoss, P;Mathewson, A;Wright, WMD;Stam, F (2013) Mechanical assessment of an anisotropic conductive adhesive joint of a direct access sensor on a flexible substrate for a swallowable capsule application. : PERGAMON-ELSEVIER SCIENCE LTD. [Details] |
| 2007 | Talanta | Voltammetric characterisation of silicon-based microelectrode arrays and their application to mercury-free stripping voltammetry of copper ions Berduque, A;Lanyon, YH;Beni, V;Herzog, G;Watson, YE;Rodgers, K;Stam, F;Alderman, J;Arrigan, DWM (2007) Voltammetric characterisation of silicon-based microelectrode arrays and their application to mercury-free stripping voltammetry of copper ions. : ELSEVIER SCIENCE BV. [Details] |
| 2007 | Talanta | Voltammetric Characterisation of Silicon-Based Microelectrode Arrays and Their Application to Mercury-Free Stripping Voltammetry of Copper Ions Berduque, A, Lanyon, YH, Beni, V, Herzog, G, Watson, YE, Rodgers, K, Stam, F, Alderman, J, Arrigan, DWM; (2007) Voltammetric Characterisation of Silicon-Based Microelectrode Arrays and Their Application to Mercury-Free Stripping Voltammetry of Copper Ions. : . [Details] |
| 2001 | IEEE Transactions On Components and Packaging Technologies | The effect of power cycling on the reliability of lead-free surface mount assemblies Davitt, Elaine and Stam, Frank A and Barrett, John (2001) The effect of power cycling on the reliability of lead-free surface mount assemblies. : . |
| 2001 | Microelectronics Reliability | Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints Stam, FA and Davitt, E (2001) Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints. : . |
| 2001 | Advanced Engineering Materials | Application of amorphous silicon thin-film position-sensitive detector to optical rules Martins, R,Teodoro, P,Soares, F,Ferreira, I,Guimaraes, N,Fortunato, E,Borges, J,Jose, G,Groth, A,Schultze, L,Berndt, D,Reichel, F,Stam, F (2001) Application of amorphous silicon thin-film position-sensitive detector to optical rules. : . |
| 2001 | Advanced Engineering Materials | Application of amorphous silicon thin-film position-sensitive detector to optical rules Martins, R;Teodoro, P;Soares, F;Ferreira, I;Guimaraes, N;Fortunato, E;Borges, J;Jose, G;Groth, A;Schultze, L;Berndt, D;Reichel, F;Stam, F (2001) Application of amorphous silicon thin-film position-sensitive detector to optical rules. : WILEY-BLACKWELL. |
| 1999 | Microelectronics International | A simple modification of a flip-chip bonder to allow large area chip attach Fuchs, S and Rindelhardt, K and Barrett, J and Stam, F (1999) A simple modification of a flip-chip bonder to allow large area chip attach. : . |
| 1998 | International Journal of Microelectronics Packaging | Evaluation of adhesive based flip-chip interconnect techniques Nagle, R and Stam, F and Barrett, J (1998) Evaluation of adhesive based flip-chip interconnect techniques. : . |
| 1995 | Journal Of Electronics Manufacturing | CHARACTERIZATION AND RELIABILITY STUDY OF ANISOTROPIC CONDUCTIVE ADHESIVES FOR FINE-PITCH PACKAGE ASSEMBLY STAM, F,OGRADY, P,BARRETT, J (1995) CHARACTERIZATION AND RELIABILITY STUDY OF ANISOTROPIC CONDUCTIVE ADHESIVES FOR FINE-PITCH PACKAGE ASSEMBLY. : . |
| 1993 | Simulation | Macro Requirement Within a Simulation Interface Ahmad, M Munir and Stam, Frank A (1993) Macro Requirement Within a Simulation Interface. : . |
| Year | Publication |
|---|---|
| 2017 | SPIE Microtechnologies, Bio-MEMS and Medical Microdevices III Frank Stam, Heikki Kuisma, Feng Gao, Jaakko Saarilahti, David Gomes Martins, Anu Kärkkäinen, Brendan Marrinan, and Sebastian Pintal (2017) SPIE Microtechnologies, Bio-MEMS and Medical Microdevices III. : . [Details] |
| 2016 | SENSORS AND ACTUATORS A-PHYSICAL Jackson, N;Stam, F;Olszewski, OZ;Doyle, H;Quinn, A;Mathewson, A (2016) SENSORS AND ACTUATORS A-PHYSICAL. : ELSEVIER SCIENCE SA. [Details] |
| 2015 | Eurosensors N.Jackson, F. Stam, O. Olszewski, R. Houlihan, A. Mathewson (2015) Eurosensors. : . |
| 2015 | EUROSENSORS 2015 Jackson, N;Stam, F;Olszewski, OZ;Houlihan, R;Mathewson, A (2015) EUROSENSORS 2015. : ELSEVIER SCIENCE BV. [Details] |
| 2012 | International Conference on Biomedical Engineering 2012 Jackson, Nathan and Verbrugghe, Peter and Embrechts, Anika and Herijgers, Paul and Mendes, Eduardo and Stam, Frank (2012) International Conference on Biomedical Engineering 2012. : . |
| 2011 | Biofuture Conference 2011 Verbrugghe, Peter and Jackson, Nathan and Embrechts, Anika and Meuris, Bart and Stam, Frank and Mendes, Eduardo and Herijgers, Paul (2011) Biofuture Conference 2011. : . |
| 2011 | IEEE International Reliability Physics Symposium (IRPS 2011) Jesudoss, P; Mathewson, A; Wright, WMD; Twomey, K; Stam, F; (2011) IEEE International Reliability Physics Symposium (IRPS 2011). : . |
| 2011 | 2011 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) Jesudoss, P;Mathewson, A;Twomey, K;Stam, F;Wright, WMD (2011) 2011 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS). : IEEE. |
| 2010 | Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th Jesudoss, Pio and Chen, Wenbin and Mathewson, Alan and Wright, William MD and McCarthy, Kevin G and Stam, Frank (2010) Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th. : . |
| 2010 | 2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) Hilt, T;Boutry, H;Franiatte, R;Rothan, F;Sillon, N;Stam, F;Mathewson, A;Wang, NN;O'Mathuna, C;Rodgers, K (2010) 2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC). : IEEE. |
| 2010 | Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th Hilt, Thierry; Boutry, Herve;Franiatte, Remi;Rothan, Frederic;Sillon, Nicolas;Stam, Frank;Mathewson, Alan;Wang, Ningning;O'Mathuna, Cian;Rodgers, Kenneth; (2010) Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th. : . [Details] |
| 2010 | IMAPS International Conference on Device Packaging Ramm, Peter and Lietaer, Nicolas and De Raedt, Walter and Fritsch, Thomas and Hilt, Thierry and Couderc, Pascal and Val, Christian and Mathewson, Alan and Razeeb, Kafil M and Stam, Frank and others (2010) IMAPS International Conference on Device Packaging. : . |
| 2010 | 2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) Jesudoss, P;Chen, WB;Mathewson, A;Wright, WMD;McCarthy, KG;Stam, F (2010) 2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC). : IEEE. |
| 2009 | 2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4 Stam, F;Razeeb, KM;Salwa, S;Mathewson, A (2009) 2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4. : IEEE. |
| 2009 | 2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2 Jesudoss, P;Mathewson, A;Wright, W;McCaffrey, C;Ogurtsov, V;Twomey, K;Stam, F (2009) 2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2. : IEEE. |
| 2009 | Electronic Components and Technology Conference, 2009. ECTC 2009. 59th Stam, F and Razeeb, KM and Salwa, S and Mathewson, A (2009) Electronic Components and Technology Conference, 2009. ECTC 2009. 59th. : . |
| 2009 | Microelectronics and Packaging Conference, 2009. EMPC 2009. European Jesudoss, Pio and Mathewson, Alan and Wright, William and McCaffrey, Colm and Ogurtsov, Vladimir and Twomey, Karen and Stam, Frank (2009) Microelectronics and Packaging Conference, 2009. EMPC 2009. European. : . |
| 2008 | 2008 26TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, VOLS 1 AND 2, PROCEEDINGS Jesudoss, P;Mathewson, A;Wright, W;Stam, F (2008) 2008 26TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, VOLS 1 AND 2, PROCEEDINGS. : IEEE. |
| 2008 | 26th International Conference on Microelectronics (MIEL 2008) Jesudoss, P; Mathewson, A; Wright, W; Stam, F; (2008) 26th International Conference on Microelectronics (MIEL 2008). : . |
| 2008 | Proc. XXXII International Microelectronics and Packaging IMAPS-IEEE CPMT Poland Conference (IMAPS-CPMT 2008) Jesudoss, P. Mathewson, A; Wright, W; O'Flynn, B; Stam, F; (2008) Proc. XXXII International Microelectronics and Packaging IMAPS-IEEE CPMT Poland Conference (IMAPS-CPMT 2008). : . |
| 2004 | SENSORS AND ACTUATORS B-CHEMICAL Barsony, I;Furjes, P;Adam, M;Ducso, C;Vizvary, Z;Zettner, J;Stam, F (2004) SENSORS AND ACTUATORS B-CHEMICAL. : ELSEVIER SCIENCE SA. [Details] |
| 2003 | SENSORS AND ACTUATORS B-CHEMICAL Norman, A;Stam, F;Morrissey, A;Hirschfelder, M;Enderlein, D (2003) SENSORS AND ACTUATORS B-CHEMICAL. : ELSEVIER SCIENCE SA. [Details] |
| 2003 | Sensors, 2003. Proceedings of IEEE Norman, Aaron and Stam, Frank and Ducso, C (2003) Sensors, 2003. Proceedings of IEEE. : . |
| 2003 | PROCEEDINGS OF THE IEEE SENSORS 2003, VOLS 1 AND 2 Norman, A;Stam, F;Ducso, C (2003) PROCEEDINGS OF THE IEEE SENSORS 2003, VOLS 1 AND 2. : IEEE. |
| 2002 | SECOND JOINT EMBS-BMES CONFERENCE 2002, VOLS 1-3, CONFERENCE PROCEEDINGS Piggott, JM;Berney, H;Hurley, E;Clair, J;Hofmann, M;Stam, F;Morrissey, A;Sheehan, MM (2002) SECOND JOINT EMBS-BMES CONFERENCE 2002, VOLS 1-3, CONFERENCE PROCEEDINGS. : IEEE. |
| 2000 | Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on Vuorela, M and Holloway, M and Fuchs, S and Stam, F and Kivilahti, J (2000) Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on. : . |
| 1999 | Proceedings of the 1999 International Symposium on Microelectronics. Stam, FA and Davitt, E and Barrett, J (1999) Proceedings of the 1999 International Symposium on Microelectronics.. : . |
| 1998 | Lasers and Electro-Optics Europe, 1998. 1998 CLEO/Europe. Conference on Crean, GM and Paineau, S and Corbett, B and O'Connell, D and Rodgers, K and Stam, F and Kelly, PV and Redmond, G (1998) Lasers and Electro-Optics Europe, 1998. 1998 CLEO/Europe. Conference on. : . |
| 1995 | JOURNAL OF ELECTRONICS MANUFACTURING STAM, F;OGRADY, P;BARRETT, J (1995) JOURNAL OF ELECTRONICS MANUFACTURING. : WORLD SCIENTIFIC PUBL CO PTE LTD. |
| 1991 | Factory Automation and Information Management - FAIM 1991 Stam, Frank A and Ahmad, M Munir (1991) Factory Automation and Information Management - FAIM 1991 . : . |
| Year | Publication |
|---|---|
| 1999 | Proceedings of the 10th International Symposium on Olfaction and Electronic Nose ISOEN'03 K.Twomey, A. Rau, K. Murphy, F. Stam, B.O'Connor, J.Alderman; (1999) Proceedings of the 10th International Symposium on Olfaction and Electronic Nose ISOEN'03. : . |
| Year | Publication |
|---|---|
| 2000 | Low-stress hybridisation of emitters, detectors and driver circuitry on a silicon motherboard for optoelectronic interconnect architecture Corbett, B and Rodgers, K and Stam, FA and O’Connell, D and Kelly, PV and Crean, GM (2000) Low-stress hybridisation of emitters, detectors and driver circuitry on a silicon motherboard for optoelectronic interconnect architecture. : . |
| 1995 | Characterisation and reliability study of anisotropic conductive adhesives for fine pitch package assembly Stam, F and O'Grady, P and Barrett, J (1995) Characterisation and reliability study of anisotropic conductive adhesives for fine pitch package assembly. : . |
| Student | Degree | Graduation Year | Institution | Thesis |
|---|---|---|---|---|
| Cian Clarke | Masters of Engineering Science | NUI (UCC) | Development of novel liquid metal electronic interconnects | |
| Nicolle Wilke | PHD | NUI (UCC) | Fabrication of microneedle arrays for drug delivery using wet etch technologies | |
| Pio Jesudoss | PHD | NUI (UCC) | Development and reliability of a direct access sensor using flip-chip-on-flex technology and anisotropic conductive adhesive | |
| James O’Reilly | MEngSc | NUI (UCC) | Reliability and failure analysis of fine pitch IC package connection | |
| Siti Salwa Mat Isa | MEngSc | UCC | Novel 3D Submicron Interconnect | |
| Daniel O’Keeffe | MEngSc | UCC | Design and fabrication of an on-chip potentiostat | |
| Ken Hernan | MEngSc | UCC | Electroless and electroplating for flip-chip bonding | |
| Elaine Davitt | MEngSc | UCC | The use of power cycling to compare the quality and reliability of Pb-free and Pb bearing surface mount solder joints | |
| Laurence O’Rourke | MEngSc | UCC | The integrated decoupling capacitor | |
| Roger Nagle | MEngSc | UCC | Adhesive based flip-chip assembly |