This website uses cookies
Read More
Ok
Leader in
Integrated ICT Hardware & Systems
About
Close
About Us
Overview
Facility Description
Strategy
Strategic Objectives
Organisation
Board Members
John Tyndall
History
ISO Certification
News & Events
News
Events
Tyndall Technology Days
Schedule
Venue
Register
Speakers
Media Corner
Internal Events
Internal Events
Documentation
Categ A
Categ B
Testimonials
Research
Close
Research
Sample
Sample 2
Photonics
Theory Pedro123
III-V & III-Nitride Materials
Devices
Electronics
Integration
Packaging
Communications (Photonic Systems)
Bio Photonics
CAPPA
III-V & III-Nitride materials
Research Groups
III-V Materials & Devices
Centre for Advanced Photonics & Process Analysis (CAPPA)
III-Nitride Materials
Epitaxy & Physics of Nanostructures
Integrated Photonics
Photonic Packaging
Photonic Systems Group
Photonics Theory
Bio Photonics
Micro & Nano Systems
Integrated Sensors & Actuators
Electrochemical Nanosensors for Animal Health
Surface-Enhanced Raman Spectroscopy
Electrochemical Sensing
Nanoporous Materials
Nano Materials Based Sensor
Nanowire
Gas Sensing
Radiation Sensors
Device & Systems for Radiation Dosimetry
MEMS Sensors
Resonators
Micro-Power Platforms
Energy Storage
Electrochemical Materials for Energy Storage
Hybrid Energy Storage
Solid State Energy Storage
Solar Energy Materials
Photonic Band Gap Materials
Roll-to-Roll Coating Technologies
Energy Harvesting
Electromechanical
Electromagnetic
Thermoelectric Generator
Piezoelectric
Integrated Magnetics
Power Management Circuits
Emerging Material & Devices
Nano Materials for Sensing
Electrochemical Materials & Energy
Atomic Layer Deposition
Chemical Vapour Deposition
Anti-Microbial Surfaces
Modelling Atomic Layer Deposition
Mechanism of Alumina ALD
Clean-up of III-V Oxides
Multi-scale Simulation
Hafnia and Zirconia Precursors
Interfaces with Oxides
ALD of Silicon-Based Materials
Deposition of Copper Metal
Materials Modelling for Catalysis & Transparent Electrodes
Modified TiO2 Photocatalysts
Doped Ceria for Catalysis
Photocatalysis
Materials Theory
Transport and Atomic Structure in Semiconductor Alloys
Group IV Semiconductor Alloys
Dilute Nitrides
Silicon Nanowires
Interfaces
Ultrafast Photoexcitation of Materials
Coherent Photons
Thermoelectric Materials
Publications
People
Piezoelectrics Materials for Energy Harvesting & Sensing
Piezo MEMS
Piezo MEMS/BioMEMS
Energy Harvesting
Resonators
Smart Materials
Piezoelectrics
Magnetics
Stimuli Responsive Hydrogels
Material Properities
Medical Applications
Smart Interconnect
Nano Interconnect
High Temperature Die Attach
Development & Electrical Characterisation of Emerging Devices
High K
III-V
MLD
2D Materials & Devices
Micropower Systems & Nanomagnetics
Nanomagnetics
Thermal Management
Thermo Electric Cooler
Thermal Interface Materials
Integration
Wireless Sensor Network
Electrochemical Sensor & Systems
Lab on a Chip
Smart Systems Integration
Wireless Sensor Networks
Bio Mechanic and Motion Monitoring
Smart Radio Systems
Location Aware Systems
Smart Systems Integration
Industry Interaction
Industry Projects
Technology Transfer
Funding Mechanisms
Partners in H2020
SME's Innovation Partnership
HSI (Hetrogenous Systems Integration)
Electrochemical Sensor & Systems
Impedometric
Ampermetric
Electronic Instrumentation Systems (EIS)
Lab on a Chip
Optical DNA Microarray Detection Platform
Nano Particle Synthesis
CE-Systems
DNA Amplification Lab-on-Chip
Protein Detection on Chip
Multiparameter System for Monitoring Cell Health
Current & Past Students
Publications from PI
RF MEMS
Micro Transdermal Interface Platforms (MicroTIPs)
Dry Electrodes
Transdermal Drug Delivery
Diagnostic
Smart Dressings
Neuromodulation
Electrode Systems
Biomedical Microsystems
Flip Chip Interconnect
IC Design MCCI
Research Groups
WSN (Wireless Sensor Networks)
Integrated Magnetics
EMAE (Electrochemical Materials and Energy)
ICT 4 Energy
Circuits & Systems
HSI (Hetrogenous Systems Integration)
LSI (Life Science Interface) ICT4Health
EIS (Electronic Instrumentation Systems)
MMS (Molecular Microsystems)
Sensing and Separation Group
NTG (Nano Technology)
AMSG (Advanced Materials & Surfaces)
Micropower Systems & Nanomagnetics
RF Systems on Chip
Strategic Programmes
ICT4Health
ICT4Energy Efficiency
Publications
Publication of the Year 2020
Funded Programmes
EU Programmes
EU
SFI
Enterprise Ireland
Other
Education
Close
Overview
PhD Training for National Collaborations
Study at Tyndall
Application Information
PhD and Masters Vacancies
Student Life
Funding Opportunities
Useful Info for Students/Supervisers
Programmes
Research Student Supervision Procedures
Module Information
Student Awards & PhD Theses
Relocating to Cork
About Cork
Pre-Arrival
On Arrival
Newcomers Guide to Cork
Makerspace
Outreach
Industry
Close
Industry
Engaging With Us
Contract Research
Collaborative Research
Funding Mechanisms
Technology Licensing
Start Ups
Founder Programme
Entrepreneur in Residence
Testimonials
Services to Industry
Industry Partners
Students to Industry
Careers
Close
Careers
Vacancies
Marie Curie Research Programmes
Internships and Co-Op Placements
Benefits
Meet Our People
Postgraduate Study at Tyndall
PhD Studentships
Masters Studentships
Postgraduate Application Procedure
EU & Non-EU Applicants
Student Profiles
Relocating to Cork
About Cork
Pre-Arrival
On Arrival
Newcomers Guide to Cork
Work Authorisation
Alumni
Useful Links
Services
Close
Services
Process & Product Development
Process Technology
Process & Product Development Team
DTE - Design Technology Evaluation Group
FPGA Design
Intellectual Property Investigation
TLP-ESD Characterisation
IC Design Characterisation
IC & Technology Assessment
OACF Characterisation Facility
Electron Microscopy
SEM, TEM, FIB Sectioning, EDX
Electronics Packaging & Reliability Services
Reliability Testing
Micro Electronics & Micro Systems Packaging
Electronic Packing & Integration
Component Analysis
Photonic Packaging
Photonic Packing & Integration
Infrastructure Access
Gateone
Smarter SI
ASCENT
Centres
Close
Hosted Centres
IPIC
IERC
Connect
MCCI
Space Solutions Centre Ireland
Tests
Close
File test 1
File test 2
Explorer
Close
Open Call
About
Overview
Team
Training
Current Fellows
Contact
Twitter
LinkedIn
YouTube
Vine
Subscribe
Intranet
Home
People
Declan Casey - Process Engineer
Contact
+353 (0)21 2346225
declan.casey (at) tyndall (dot) ie
Centre:
MNS (Materials and Devices)
Subscribe
.svg)
